发明名称 BOILING COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To enable heat transfer from a heat receiving wall to a cooling medium to be improved in efficiency by a method wherein a porous layer is provided for the inner surface of the heat receiving wall where a heat releasing body is provided in a boiling cooling device. SOLUTION: A boiling cooling case 2 receives heat released from a heat releasing body, and boiling cooling medium vapor is introduced into a heat radiator 9 to liquidize by exchanging heat with an external fluid. The boiling cooling case 2 and the heat radiator 9 are formed integrally by brazing. A porous layer 4 2 mm or below in thickness is provided for the inner surface of the heat receiving wall 3 nearest to the heat releasing body mounting surface 3a of the boiling cooling case 2. The porous layer 4 is formed of metal material such as an aluminum alloy excellent in thermal conductivity through such a manner where microparticles, powder, wires, rods, or metal gauzes of aluminum alloy are compression-molded by pressing a sintered metal, metal fibers, or metal meshes, and the layer 4 is formed of one material selected out of the above materials.
申请公布号 JP2001077257(A) 申请公布日期 2001.03.23
申请号 JP19990252929 申请日期 1999.09.07
申请人 DENSO CORP 发明人 TANAKA EITARO;TERAO MASAYOSHI;KAWAGUCHI SEIJI
分类号 H01L23/427;(IPC1-7):H01L23/427 主分类号 H01L23/427
代理机构 代理人
主权项
地址