| 摘要 |
PROBLEM TO BE SOLVED: To provide a board for mounting semiconductor elements, which is capable of directly locating borders between semiconductor devices, exhibits superior positioning accuracy for dicing, and is suitable for manufacturing chip-sized semiconductor devices. SOLUTION: This board 1 for mounting semiconductor elements is a type where a plurality of semiconductor devices are collectively sealed with resin, and the resulting body is thereafter diced into semiconductor device units 4. In manufacturing the board 1, marks 5 are provided at locations along the extensions of borders between the devices 4 for dicing. These marks 5 preferably have a configuration for indicating a dicing width W. |
