| 摘要 |
PROBLEM TO BE SOLVED: To form a solder ball by extruding a fused solder from an orifice without using an extruding member which moves forward and backward while keeping contact with the high temperature of fused solder. SOLUTION: A solder ball forming device 1 is provided with the first and the second solder storing parts 3 and 4 which store a fused solder 2 and which communicate through a communicating path 7. The second solder storing part 4 is composed of a close-end cylindrical part 4a and a ceiling part 4b which extends from the upper end of the part 4a and the circumference of which becomes narrower toward the above, and the part 4 comprises an orifice 6 at the center of the bottom which makes the solder storing part 4 communicate with the outside. The end of a path 11 for supplying nitrogen gas for the fused solder 2 is connected to the cylindrical part 4a. In the solder ball forming device 1, a switching valve 12 for controlling the supply of nitrogen gas from a nitrogen bomb to the path 11 is arranged. The valve 12 is driven by a Langevin vibrator 14. When the nitrogen gas is supplied to the solder storing part 4, the fused solder 2 is extruded from the orifice 6 so as to form a solder ball 24.
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