发明名称 METHOD FOR PLATING METAL MOLD FOR FORMING GLASS
摘要 PROBLEM TO BE SOLVED: To surely remove microbubbles and gas pockets and to form a plating film which is good and uniform by forming a plating layer on the surface of a metal mold while oscillating the metal mold immersed in a plating liquid. SOLUTION: A plunger P consisting of stainless steel is held inclined in such a manner that all of the surfaces of a face forming surface f and skirt forming surfaces of constituting flanks are preferably not paralleled to a horizontal surface and the plunger is fixed in this state to the front end of a supporting arm 11 by means of a bolt. The arm 11 hanging the plunger P is moved above a plating bath tank 10 by a hoist and is then lowered to fit both ends of a shat 18 of the supporting arm 11 into the grooves of receiving rails 19. The plunger P is then immersed in the inclined state into the plating liquid. While the plunger P is oscillated by driving a motor M, its surface is plated. The plating film is free from plating pits and plating unevenness and the metal mold sufficiently applicable to forming of high-grade glass products is obtained.
申请公布号 JP2001073156(A) 申请公布日期 2001.03.21
申请号 JP19990255171 申请日期 1999.09.09
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 ECCHU OSAMU
分类号 C03B40/00;C03B11/00;C23C18/16;(IPC1-7):C23C18/16 主分类号 C03B40/00
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