发明名称 |
METHOD FOR PLATING METAL MOLD FOR FORMING GLASS |
摘要 |
PROBLEM TO BE SOLVED: To surely remove microbubbles and gas pockets and to form a plating film which is good and uniform by forming a plating layer on the surface of a metal mold while oscillating the metal mold immersed in a plating liquid. SOLUTION: A plunger P consisting of stainless steel is held inclined in such a manner that all of the surfaces of a face forming surface f and skirt forming surfaces of constituting flanks are preferably not paralleled to a horizontal surface and the plunger is fixed in this state to the front end of a supporting arm 11 by means of a bolt. The arm 11 hanging the plunger P is moved above a plating bath tank 10 by a hoist and is then lowered to fit both ends of a shat 18 of the supporting arm 11 into the grooves of receiving rails 19. The plunger P is then immersed in the inclined state into the plating liquid. While the plunger P is oscillated by driving a motor M, its surface is plated. The plating film is free from plating pits and plating unevenness and the metal mold sufficiently applicable to forming of high-grade glass products is obtained.
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申请公布号 |
JP2001073156(A) |
申请公布日期 |
2001.03.21 |
申请号 |
JP19990255171 |
申请日期 |
1999.09.09 |
申请人 |
NIPPON ELECTRIC GLASS CO LTD |
发明人 |
ECCHU OSAMU |
分类号 |
C03B40/00;C03B11/00;C23C18/16;(IPC1-7):C23C18/16 |
主分类号 |
C03B40/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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