| 摘要 |
<p>PURPOSE: A semiconductor package is provided to satisfy an existing mounting specification by maintaining an established ball arrangement in reducing a chip by a package process using a pad rearrangement technique. CONSTITUTION: A semiconductor package comprises a chip(31) having a pad, a die supporting polymer(37), a stress buffering polymer(38a), a pad rearrangement metal wire(39a), a solder masking polymer(40) and solder balls(41). The die supporting polymer is established near the side surface of the chip, having the same height as the chip. The stress buffering polymer is established on the chip and die supporting polymer except the pad portion. The pad rearrangement metal wire contacts the pad, and is established on the stress buffering polymer as a predetermined pattern. The solder masking polymer is established to open a part of the pad rearrangement metal wire. The solder balls are connected to the pad rearrangement metal wire through the open portion of the solder masking polymer.</p> |
