| 摘要 |
<p>PROBLEM TO BE SOLVED: To execute laser beam machining with ease as well as with low cost by simplifying the structure of a device. SOLUTION: A bottom surface of a wafer 20 is fixed on a fixed structure 11. By turning the wafer 20 fixed on the fixed structure 11 clockwise (in theθdirection) by aθaxis driving device 12, an eccentric quantity of the wafer 20 and a position of an orientation flag 20a are measured by the position detecting device 15. After that, the wafer 20 fixed on the fixed structrure 11 is turned clockwise (in theθdirection) by aθaxis driving device 12, and then the wafer 20 is subjected to orientation regarding (θdirection so that the orientation flag 20a is located at a prescribed position in the circumferential direction. Lastly, to the wafer 20 positioned concerning the direction ofθin this way, the laser beam emitted from a laser beam device is guided through a beam scanner mechanism, the laser beam is projected on a prescribed position on the wafer 20, and thus laser beam machining is started.</p> |
