| 摘要 |
An apparatus for heat treating semiconductor wafers is disclosed. In accordance with the present invention, the apparatus includes a temperature measuring system for determining the temperature of semiconductor wafers being heated within the apparatus. The temperature measurement system includes a shield member made from, for instance, ceramic which is placed adjacent to the semiconductor wafer being heated. A temperature measuring device, such as a thermocouple, is placed in association with the shield member. As the wafer is heated, the temperature of the shield member is monitored. Based on a predetermined calibration curve, by knowing the temperature of the shield member, the temperature of the semiconductor wafer can be estimated with reasonable accuracy.
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