WIRING BOARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of forming an excellent wiring pattern, and a manufacturing method of the board. SOLUTION: A Ti sputtered layer 11 and a Cu sputtered layer 13 are formed on the whole surface of the surface side of a base board 3. A resist pattern 25 is formed on the whole surface of the Cu sputtered layer 13. A Cu plating layer 15 and an Ni plating layer 17 are formed on the Cu sputtered layer 13 by first electroplating. The resist pattern 25 is dissolved and eliminated. A part of a sputtered layer 21 is eliminated by etching. By second electroplating, an Au plating layer 19 is formed so as to cover the peripheral part (upper surface and side surface) of a base part 7a of a wiring pattern 7.