| 摘要 |
PROBLEM TO BE SOLVED: To realize mounting of an FC with high reliability by preventing an IC from being inclined, due to the displacement of the IC and preventing a bubble from being involved in to cause peeling of the IC, when the IC is filled with underfill resin. SOLUTION: An IC chip 1 is connected to substrate 4 using a flip chip(FC), in which a wiring pattern 6 that is connected to the IC chip 1 is formed on one surface, underfill resin 8 is filled between the IC chip 1 and the substrate 4 to adhere, and a solder resist 7 is provided along the wiring pattern to block solder outflow. A strut of a dry film 10 almost about 50 or 75μm thick is arranged between the IC chip 1 and the substrate 4 in order to hold the IC chip 1 at a prescribed height. The shape of the dry film 10 is formed, so that a pattern formed on the active surface side of the IC chip 1 is removed and a solder resist layer 11 that increases the adhesion between the dry film 10, and the substrate 4 is formed. A high reliability FC-mounting electronic component and an FC-mounting circuit unit are obtained. |
