| 摘要 |
PROBLEM TO BE SOLVED: To hermetically seal a semiconductor or a micro device in the semiconductor non-electrically at low temperatures. SOLUTION: The manufacturing method of a wafer package 10 comprises the steps in which first and second wafers 12, 24, and a micro device 14 are provided and a bonding pad 16 and a peripheral pad 20 are formed on the first wafer 12, a first sealing member 34 matching the peripheral edge of the bonding pad 16 and a second sealing member 22 are formed on the second wafer 24 and a groove is made in the second wafer 24. In order to form a hermetically sealed space 25 between the first and second wafers 12, 24, bonding is affected according to the first and second wafers 12, 24 utilizing the sealing members 34, 22, the bonding pad 16 and the peripheral pad 20. Subsequently, a part of the second wafer 24 is removed to make a through-hole 26 which reaches the bonding pad 16. |
