发明名称 DEVICE AND METHOD FOR MOUNTING ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a device and a method for mounting electronic parts where wasteful time is excluded and unit process time is reduced. SOLUTION: The device for mounting electronic parts on a substrate 3 by picking them up from supply parts 4a and 4b for supplying the electronic parts using a plurality of transfer heads 8A and 8B is equipped with tentative installation stages 10A and 10B for receiving electronic parts from each transfer head and tentatively installing them and performs next mounted parts preparation operation for picking up the next electronic parts for mounting from a supply part by one transfer head concerned and tentatively mounting them on the tentative installation stages 8A and 8B when a mounting operation for mounting the electronic parts to the substrate by one transfer head is completed faster than the mounting operation by the other transfer head, thus effectively utilizing the standby time of the transfer head where the mounting operation has been completed and reducing entire tact time.
申请公布号 JP2001068894(A) 申请公布日期 2001.03.16
申请号 JP19990239336 申请日期 1999.08.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAGAO KAZUHIDE;KASHIWAGI YASUHIRO
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址