| 摘要 |
PURPOSE: A method for manufacturing a wafer level flip chip package using anisotropic conductive adhesive is provided to realize a chip-sized package with simplified, economical and high productive process and material. CONSTITUTION: A wafer is provided with a plurality of chips(7) each covered with a passivation layer(3) and having I/O pads(2) formed thereon. In the wafer level, a plurality of low-priced non-solder bumps(4) are formed on the respective I/O pads(2), and an anisotropic conductive adhesive(6) is then coated thereon. The low-priced non-solder bumps(4) may use gold stud bumps formed by bonding wires, or nickel/gold bumps formed by electroless plating. The anisotropic conductive adhesive(6) is preferably composed of a half-cured epoxy resin, nickel or gold-coated polymer balls of 2 to 15 weight percents, a solvent, and a hardening agent. The anisotropic conductive adhesive(6) may have a form of a film or paste. After dicing the wafer into individual chips(7), each chip(7) is bonded to a substrate by flip chip bonding technique. |
