| 摘要 |
PURPOSE: To mount a package substrate which is vertical to a packaging substrate for mounting a semiconductor chip by equipping the package substrate with first and second main surfaces and a side end face that oppose each other with the semiconductor chip and a lead pin for electrical connection, extending in one direction and nearly in parallel with the main surface on the side end face. CONSTITUTION: Semiconductor chips 11 and 12 are arranged via a die pad 7 on the main surface at both the front and rear sides of a package substrate 13, where a lead pin 9 is arranged only on one side end face. The semiconductor chips 11 and 12 are connected to a package substrate pad provided on the package substrate 13 with wire 6. The package substrate pad is connected to an internal wiring 14, through the inside of the package substrate 13. Also the internal wiring 14 is connected to the lead pin 9 projecting from one side end face of the package substrate 13 to the outside. The semiconductor chips 11 and 12, the die pad 7, and the wire 6 are covered with mold 4 for covering the surface of the package substrate 13, thus packaging the semiconductor device two dimensionally for the packaging substrate with high density. |
