APPARATUS FOR ELIMINATING FOREIGN SUBSTANCE IN FOAMING MOLD OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An apparatus for eliminating a foreign substance in a foaming mold of a semiconductor package is provided to eliminate a foreign substance such as a resin adhered to a lead frame, by spraying air to the lead frame through an air spraying hole. CONSTITUTION: An upper mold(12) is installed on a lower mold(11) on which a lead frame(10) is placed. A plurality of punches(13) are installed in the upper mold. A stripper plate(14) is installed between the upper and lower molds. Air spraying holes(15) are installed on a lower surface of the punches to spray air to the transferred lead frame and to eliminate a foreign substance. An air supply line for supplying air is connected to a side of the stripper plate so that air can be sprayed into the air spraying holes. A position detecting sensor(17) is installed at a side of the upper mold to recognize a position of the upper mold.