| 摘要 |
A filter chip lying on an upper surface of a top layer package substrate is connected to an upper surface ground electrode ( 235 ). The upper ground electrode ( 235 ) and a lower surface ground electrode ( 237 ) are connected to each other via through electrodes ( 261, 262, 263 ), ground wiring patterns ( 251, 252 ), first connecting lines ( 271 to 276 ), and second connecting lines ( 281, 282 ). The first connecting lines ( 271 to 276 ) are connected to the ground wiring patterns ( 251, 252 ), whereas the second connecting lines ( 281, 282 ) are not connected to the ground wiring patterns ( 251, 252 ), respectively. Owing to the provision of the connecting lines connected to the ground wiring patterns ( 251, 252 ) and the connecting lines unconnected to the ground wiring patterns ( 251, 252 ), the impedance between a multilayer package substrate and ground can be adjusted.
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