SEMICONDUCTOR DEVICE HAVING SOLDER BALL

摘要

PURPOSE: A semiconductor device having a solder ball is provided to prevent a metal interconnection from being corroded by moisture absorbed in the solder ball, by forming a silicon nitride-based insulating layer on the metal interconnection electrically connecting the solder ball and a bonding pad. CONSTITUTION: An interconnection layer electrically connects a solder ball(116) with a bonding pad(102). A passivation layer(110) for the interconnection layer covers an upper portion and a sidewall of the interconnection layer to prevent the interconnection layer from being damaged. The passivation layer for the interconnection layer is silicon nitride-based insulating material.