BURIED MOLD STRUCTURE FOR EPOXY INSULATION PRODUCT

摘要

PURPOSE: A buried mold structure for epoxy insulation product is provided to minimize stress generated from the boundary surface between the semi-conductive epoxy section and the insulation section by allowing both sections to have equal coefficient of thermal expansion. CONSTITUTION: A mold(34) has a concave-convex portion formed along an outer periphery of the mold so as to enhance coupling force, and a semi-conductive epoxy section(38) having the coefficient of thermal expansion same as that of an insulation section(30) is attached to the concave-convex portion of the mold. The semi-conductive epoxy section formed integrally with the mold is buried to the insulation section, thereby completing manufacturing of epoxy insulation product.