发明名称 Photocurable resin composition
摘要 There is provided a photocurable resin composition comprising (A) an urethane acrylate having three or four acrylate groups in the molecule, (B) a radical polymerizable compound different from the above urethane acrylate; and (C) a photopolymerization initiator, the weight ratio of the urethane acrylate (A) to the radical polymerizable compound (B) being 80:20 to 10:90; and a production process thereof. The said photocurable resin composition can provide moldings and stereolithographed objects having excellent dimensional accuracy with a small volume shrinkage factor at the time of photo-curing and excellent heat resistance with a high thermal deformation temperature as well as excellent transparency and mechanical properties such as tensile strength.
申请公布号 US6200732(B1) 申请公布日期 2001.03.13
申请号 US19970837982 申请日期 1997.04.14
申请人 TEIJIN SEIKEI CO., LTD. 发明人 TAMURA YORIKAZU;HAGIWARA TSUNEO
分类号 G03F7/00;G03F7/027;(IPC1-7):G03F7/027;G03F7/26;G03C9/08 主分类号 G03F7/00
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