| 摘要 |
PROBLEM TO BE SOLVED: To cut laver in a desired size and shape by cutting the laver with a knife blade with ultrasonic vibrational energy applied. SOLUTION: In this laver cutting line device, the laver of the whole shape entered into an inlet port 1 is cut while conveyed by cutters 4, 5 with ultrasonic vibration applied to a cutting line, and the chip after the cutting is sucked to a suction port mounted on a device part. The desired number of cutters 4, 5 are fixed to predetermined positions by means of screws in advance corresponding to the cutting size and shape, and the laver is moved to be cut. As the ultrasonic vibrational energy is applied to the cutting to utilize the cutting force of vibrated cutting edges, the fine powder-like chip is hardly generated in the cutting. That is, there is no need for the installation of a large-scaled recovering device, and the work of removing the fine powder-like ship caught by the cut lavers is dispensed with, and further the mechanical noise can be completely prevented, so that the silent working environment can be ensured.
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