发明名称 Method and apparatus for manufacturing semiconductor device
摘要 In a method of manufacturing a semiconductor device including a capacitor, a refractory metal layer is dry-etched using a resist pattern as a mask, whereby a first electrode pattern formed of refractory metal is provided. Sidewall of the first electrode pattern is cleaned using aqueous solution of a surface active agent. Through this procedure, etching residue formed on the sidewall of the electrode pattern is removed when the electrode pattern of refractory metal is produced through dry etching method.
申请公布号 US6199567(B1) 申请公布日期 2001.03.13
申请号 US19960772632 申请日期 1996.12.23
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KANNO ITARU;AOYAMA TETSUO;HADA MAYUMI
分类号 H01L21/28;B08B3/12;H01L21/02;H01L21/304;H01L21/3213;H01L21/768;H01L21/8242;H01L23/522;H01L27/108;(IPC1-7):B08B3/10 主分类号 H01L21/28
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