| 摘要 |
PROBLEM TO BE SOLVED: To upgrade heat response by incorporating a compound represented by a specific structural formula as an electron acceptive compound in a heat- sensitive recording layer and incorporating a 2-naphthylbenzyl ether or the like or an oxalic acid compound represented by another specific structural formula by a specific weight ratio as a heat fusible compound. SOLUTION: In a heat-sensitive recording layer, as an electron acceptive compound, an at least one type of a compound represented by formula I is incorporated and, as a heat fusible compound, an at least one type of a 2- naphthylbenzyl ether, 1,2-bis(phenoxymethy)benzene or an oxalic acid compound represented by formula II is contained by a weight ratio of one to three times as much as an at least one type of an electron acceptive compound, wherein, in formula I, X is a hydrogen atom or alkyl group, R1, R2 and R3 are each a hydrogen atom, halogen atom, hydroxyl group or the like, R4, R5 and R6 are each a hydrogen atom, halogen atom or the like, R7 is a hydrogen atom or the like, and, in formula II, R8 is a hydrogen atom, halogen atom, alkoxy group or the like. Thus, heat response or the like become excellent. |
