发明名称 MOISTURE-PROOF INSULATION TREATMENT COMPOSITION AND PRODUCTION OF ELECTRIC AND ELECTRONIC PART SUBJECTED TO INSULATION TREATMENT
摘要 PROBLEM TO BE SOLVED: To obtain a moistureproof insulation treatment composition capable of providing a cured material suitable for moistureproof insulation treatment, etc., having excellent workability, heat resistance, flame retardance and heat dissipation and to provide a method for producing an electric and an electronic parts by carrying out insulation treatment using the moistureproof insulation treatment composition. SOLUTION: This moistureproof insulation treatment composition comprises (a) a hydride of hydroxyl group-containing liquid polyisoprene, (b) a polyisocyanate, (C) crystal silica, (d) silicon nitride and (e) a phosphoric ester. This method for producing an electric and an electronic parts comprises carrying out moistureproof insulation treatment using the moistureproof insulation treatment composition.
申请公布号 JP2001064442(A) 申请公布日期 2001.03.13
申请号 JP19990239695 申请日期 1999.08.26
申请人 HITACHI CHEM CO LTD 发明人 SHIGA SATOSHI
分类号 H05K3/28;C08G18/62;C08K13/02;C08L9/00;C08L75/04;C09D5/25;C09D109/00;(IPC1-7):C08L9/00 主分类号 H05K3/28
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