发明名称 THERMALLY FUSIBLE NONSLIP MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a thermally fusible nonslip material that fuses at 180-220 deg.C melting temperature and can be applied, and shows excellent resistance to deformation even under high-temperature conditions. SOLUTION: The objective thermally fusible nonslip material is prepared by adding 10-90 pts.wt. of a polyamide resin, 1-50 pts.wt. of a polyolefin resin, and 100-500 pts.wt. of an aggregate with a particle size of 1-5 mm (colored porcelain aggregate or the like) to 100 pts.wt. of the thermoplastic resin.
申请公布号 JP2001064407(A) 申请公布日期 2001.03.13
申请号 JP19990243540 申请日期 1999.08.30
申请人 ATOMIX CO LTD 发明人 AZUMA KOICHIRO;OGAWA HIROMI;MATSUDA TOKIO;MASUDA SHINICHI
分类号 C08J5/14;C08K3/00;C08L101/00;C08L101/16;(IPC1-7):C08J5/14 主分类号 C08J5/14
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