摘要 |
PROBLEM TO BE SOLVED: To provide a thermally fusible nonslip material that fuses at 180-220 deg.C melting temperature and can be applied, and shows excellent resistance to deformation even under high-temperature conditions. SOLUTION: The objective thermally fusible nonslip material is prepared by adding 10-90 pts.wt. of a polyamide resin, 1-50 pts.wt. of a polyolefin resin, and 100-500 pts.wt. of an aggregate with a particle size of 1-5 mm (colored porcelain aggregate or the like) to 100 pts.wt. of the thermoplastic resin.
|