发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which has a low moisture absorption and an excellent resistance to solder crack and is environmentally friendly by using, as essential ingredients, an epoxy resin obtained from a mixture of a bisphenol F and a bisphenol, a modified novolak resin obtained by condensing a phenol and a cresol with an aldehyde, a cure accelerator, and an inorganic filler, each in a specified amount. SOLUTION: The epoxy resin is prepared by converting a mixture of a bisphenol F (A) of formula I and a bisphenol (B) of formula II in a wt. ratio of (A/B) of 0.1-10 into a glycidyl ether. The novolak resin is prepared by using a phenol (C) and a cresol (D) in a molar ratio of (C/D) of 0.1-10. The equivalent ratio of the phenolic hydroxyl group of the total phenol resin to the epoxy group of the total epoxy resin is 0.5-2.0. The content of the accelerator is 0.4-20 pts.wt. based on 100 pts.wt. sum of the total epoxy resin and the total phenol resin. In the formulas, R1 and R2 are each a 1-6C alkyl; and (m) is 0-4.
申请公布号 JP2001064362(A) 申请公布日期 2001.03.13
申请号 JP19990246891 申请日期 1999.09.01
申请人 SUMITOMO BAKELITE CO LTD 发明人 SUZUKI HIROYUKI
分类号 C08K3/00;C08G59/24;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08G59/24 主分类号 C08K3/00
代理机构 代理人
主权项
地址