TABLE FOR WAFER POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a table for a wafer polishing device capable of coping with the trend toward larger bore and higher quality in a semiconductor wafer by making flatness of a polishing surface maintainable. SOLUTION: A wafer polishing device 1 is provided with a table 2 and a wafer hold plate 6. A semiconductor wafer 5 held to a hold surface 6a of the plate 6 is brought into slide contact with a polishing surface 2a provided in an upper part of the table 2. The table 2 is formed by using a material with Young's modulus 1.0 kg/cm2 (×106) or more.