| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing use excellent in adhesion to various members such as a lead frame, soldering crack resistance and temperature cycle resistance. SOLUTION: This epoxy resin composition essentially comprises an epoxy resin, a phenolic resin, an inorganic filler, a curing promoter, and 0.02-5 wt.% of an acid-modified hydrocarbon resin >=1 mgKOH/g in acid value and 1,000-5,000 in weight-average molecular weight.
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