GAS NOZZLE APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT WITH IT

摘要

A gas nozzle device and a semiconductor manufacturing apparatus including the same are provided to adjust an injection angle by forming one or more injection holes at a lower surface of a body. One or more injection holes(106) are formed at a lower surface of a body(102) to inject a gas into an inside of a chamber. A gas path(108) is formed in the inside of the body. One end of the gas path is connected to a gas supply source. The other end of the gas path is connected to the injection hole. A combination member is formed to fix the body to a sidewall of the chamber. The combination member is inserted into a plurality of fixed holes. The gas path is obliquely curved to be connected to the injection hole in the inside of the body.