| 摘要 |
PROBLEM TO BE SOLVED: To easily inspect rare short-circuiting when mounting electronic parts by including a blowing agent into an underfill for joining. SOLUTION: In a method for mounting electronic parts 1, a blowing agent is included into an underfill 6. When the electronic parts 1 and a substrate 2 are to be pressurized and heated, the underfill 6 made of thermosetting resin is subjected to heat curing, and at the same time bubbles 7 are generated. By the bubbles 7, pressure is generated between the electronic parts 1 and the substrate 2, and the electronic parts 1 and the substrate 2 are deformed in a direction where they are separated each other. When the electronic components 1 and the substrate 2 are deformed in the direction where they are separated each other, a solder ball 5 that has been in a rare short-circuited state is separated from land 3. While the solder ball 5 is separated from the land 3, the underfill 6 is cured. Impedance is measured by an inspecting device while the solder ball 5 is separated from the land 3, thus easily inspecting a disconnection state.
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