| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating apparatus of a structure, where the advantage of the fact that a treatment gas feeding source is arranged on the upper side of a substrate treating chamber and a heating source is arranged on the lower side of the chamber is applied, treatment gas can reach smoothly on the surface of a substrate and a holder for holding the substrate and a rotating member for supporting the holder can be exchanged, without dismounting the chamber. SOLUTION: A substrate treating apparatus is constituted into a structure such that the substrate treating apparatus is provided with a substrate treating chamber 1, a mechanism for substrate carrying in and carrying out, a substrate heating source 4 and a raw material feeding source 2 for treatment and at the time of a treatment of a substrate 6, a raw material for treatment is fed to the substrate from the surface facing opposite the treating surface of the substrate 6 and when the substrate 6 and a holder 7 for mounting the substrate 6 are carried in the home positions in the chamber 1 for treating the substrate 6, the space in the chamber 1 is roughly sectioned into an upper surface, which is used as a reaction space, and a lower space for arranging the source 4 and the like, using the substrate 6 as a boundary between the upper and lower spaces. In this case, the treater is provided with a rotary drive source 9 for holding the holder 7 in the state being levitated at a home position by a magnetic force at the treatment of the substrate 6. |
