| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition, superior in moldability and thermal conductivity and a semiconductor sealed device sealed up with it and superior in heat radiating properties. SOLUTION: This epoxy resin composition is composed of integral components, (A) multi-functional epoxy resin represented by formulae (in a formulae, R1 to R4 are each a hydrogen atom or an alkyl group, n denotes an integer of one or more), (B) a phenolic resin, (C) a urea hardening accelerator indicated by formula II, and (D) crystalline silica powder or molten silica powder which is 100μm or smaller in maximum grain diameter. The resin composition contains 30 to 90 wt.% (D) crystal silica powder. As shown in Figure, the epoxy resin composition has long low-viscosity molten state retention time. A semiconductor element is a semiconductor device which is sealed by this hardened resin composition.
|
