APPARATUS FOR CLEANING WAFER

摘要

PURPOSE: An apparatus for cleaning a wafer is provided to increase a cleaning effect of the wafer and to improve cleaning uniformity in the wafer, by spraying chemicals through a shower nozzle pipe located in an upper part on both sides of the cleaning apparatus so that a flow rate of the chemicals is accelerated and vortex of the chemicals is increased. CONSTITUTION: A wafer(114) is placed in an inner cleaning bath(102). An outer cleaning bath(104) is located outside the inner cleaning bath. A shower nozzle pipe(112) is disposed in an upper part on both sides of the inner cleaning bath. Chemicals are sprayed to the wafer in the inner cleaning bath through the shower nozzle pipe by external pressure.