METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to improve reliability of a package product, by preventing an interlayer dielectric in a pad portion from being exposed and cracked. CONSTITUTION: A metal interconnection is formed in a central portion(A) and a pad portion(B) of a semiconductor substrate(10). An interlayer dielectric(11) is stacked on the central and pad portions. A plug(21) of a high melting metal material is formed in a via hole of the interlayer dielectric to be connected to the metal interconnection of the central portion. A pad is connected to the metal interconnection of the pad portion through an opening of the interlayer dielectric, and a metal interconnection(23a) connected to the plug is formed.