发明名称 |
ELECTRONIC DEVICE PACKAGE AND METHOD OF FORMATION |
摘要 |
Provided are electronic device packages and their methods of formation. The electronic device packages include a sealed volume enclosing an electronic device and a feedthrough into the sealed volume for electrical connection of the electronic device. Provided are optoelectronic device packages and their methods of formation. The optoelectronic device packages include a first substrate and lid attached to the first substrate forming an enclosed volume. An optoelectronic device is disposed within the enclosed volume and a wick stop for preventing solder flow is provided. Provided are prism-coupled optical assemblies which allow for the coupling of light between an optical component, such as a laser, and an integrated optical waveguide through a prism.
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申请公布号 |
US2009154872(A1) |
申请公布日期 |
2009.06.18 |
申请号 |
US20080338918 |
申请日期 |
2008.12.18 |
申请人 |
SHERRER DAVID S;GAEBE CARL E;GETZ JAMES W;RASNAKE LARRY J;HOGAN WILLIAM K |
发明人 |
SHERRER DAVID S.;GAEBE CARL E.;GETZ JAMES W.;RASNAKE LARRY J.;HOGAN WILLIAM K. |
分类号 |
G02B6/12;G02B7/00;H05K5/06 |
主分类号 |
G02B6/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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