| 摘要 |
The present invention adopts a circuit pattern in which in a carrier of a package for coupling semiconductor devices at multistage, drawing out lines for selecting individual semiconductor devices are coupled in parallel. Thus, the present invention achieves the multistage coupling semiconductor device which can be completed with a circuit pattern of one kind regardless of the number of stages of a multistage. Using the carrier having the foregoing structure, the semiconductor device is assembled and is subjected to characteristic inspections. Thereafter, the circuit patterns, coupled in parallel, having good electrical characteristics are partially cut by either laser, sand-blast, or etching. The products can be specified according to the circuit pattern which is cut.
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