| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device wherein an element is connected to a substrate using a thin solder layer, comprising such connection structure as hard to cause poor connection. SOLUTION: A substrate 1 cornprising a metalized layer 32 on its surface, circuit elements 30 and 31 mounted on the substrate 1, and a solder layer 7 for connecting the metalized layer 32 to the circuit elements 30 and 31, are provided. Between the solder layer 7 and the metalized layer 32, a barrier layer 6 for preventing reaction between the solder layer 7 and the metalized layer 32 is provided. The barrier layer 6 comprises such material as the liquid phase of the solder layer 7 and the solid phase of the barrier layer 6 come into an equilibrium state at a specific temperature.
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