发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME
摘要 PURPOSE: To provide a semiconductor device having high reliability without lowering insulation of an insulating layer and without making contact faults. CONSTITUTION: This semiconductor device comprises a silicon substrate 1, a low-temperature aluminum film 4 and a high-temperature aluminum film 5 formed on the substrate 1 and containing a polycrystal. An opening 7 is formed by a crystal grain boundary on the surface of the film 5. Sidewalls 7a, 7b are formed so that a distance between the sidewalls 7a and 7b for forming the opening is shortened as one approaches toward the substrate 1.
申请公布号 KR20010014784(A) 申请公布日期 2001.02.26
申请号 KR20000020948 申请日期 2000.04.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 KAMOSHIMA TAKAO;TAKEWAKA HIROMOTO;YAMASHITA TAKASHI
分类号 H01L23/52;H01L21/28;H01L21/285;H01L21/3205;H01L21/768;H01L23/532;(IPC1-7):H01L21/285 主分类号 H01L23/52
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