发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME |
摘要 |
PURPOSE: To provide a semiconductor device having high reliability without lowering insulation of an insulating layer and without making contact faults. CONSTITUTION: This semiconductor device comprises a silicon substrate 1, a low-temperature aluminum film 4 and a high-temperature aluminum film 5 formed on the substrate 1 and containing a polycrystal. An opening 7 is formed by a crystal grain boundary on the surface of the film 5. Sidewalls 7a, 7b are formed so that a distance between the sidewalls 7a and 7b for forming the opening is shortened as one approaches toward the substrate 1. |
申请公布号 |
KR20010014784(A) |
申请公布日期 |
2001.02.26 |
申请号 |
KR20000020948 |
申请日期 |
2000.04.20 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
KAMOSHIMA TAKAO;TAKEWAKA HIROMOTO;YAMASHITA TAKASHI |
分类号 |
H01L23/52;H01L21/28;H01L21/285;H01L21/3205;H01L21/768;H01L23/532;(IPC1-7):H01L21/285 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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