| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an excellent epoxy resin composition for sealing a semiconductor capable of remarkably reducing the warpage of a package, good in curability and shelf life, having a high latency and providing high adhesion and to provide the semiconductor device sealed with a cured product thereof. SOLUTION: This composition comprises (A) a polyfunctional type epoxy resin, (B) a phenol resin, (C) an inorganic filler and (D) a microcapsule of a curing catalyst having 0.5-50μm average particle diameter. The polyfunctional epoxy resin is a substituted or an unsubstituted triphenolalkane type epoxy resin and the microcapsule is formed of a polymer of an acrylate-based or a methacrylate-based monomer and a curing catalyst comprising a nitrogen- containing compound and/or an organophosphorus compound.</p> |
