摘要 |
PURPOSE: To provide a method for manufacturing electronic device by which the wasteful use of a material and the number of manufacturing steps can be reduced, and to provide an electronic device. CONSTITUTION: In a method for manufacturing electronic device, an electronic device 10 is manufactured via a step of forming an assembled substrate 21, which is constituted by interconnecting a plurality of substrates corresponding to the device 10 in a matrix form, a step of mounting electronic components 12 on the substrate 21, and a step of forming a resin layer 13 cured through a vacuum printing method on the upper surface of the substrate 21 mounted with the parts 12 so as to cover the parts 12. The device 10 is also manufactured via a step of dividing the assembled substrate 21 carrying the resin layer 13 into individual substrates. When the method is used, wasteful use of a substrate material can be reduced significantly, and at the same time, the number of manufacturing steps can be reduced. |