发明名称 MANUFACTURE OF ELECTRONIC DEVICE, THE ELECTRONIC DEVICE, AND METHOD FOR FILLING RESIN
摘要 PURPOSE: To provide a method for manufacturing electronic device by which the wasteful use of a material and the number of manufacturing steps can be reduced, and to provide an electronic device. CONSTITUTION: In a method for manufacturing electronic device, an electronic device 10 is manufactured via a step of forming an assembled substrate 21, which is constituted by interconnecting a plurality of substrates corresponding to the device 10 in a matrix form, a step of mounting electronic components 12 on the substrate 21, and a step of forming a resin layer 13 cured through a vacuum printing method on the upper surface of the substrate 21 mounted with the parts 12 so as to cover the parts 12. The device 10 is also manufactured via a step of dividing the assembled substrate 21 carrying the resin layer 13 into individual substrates. When the method is used, wasteful use of a substrate material can be reduced significantly, and at the same time, the number of manufacturing steps can be reduced.
申请公布号 KR20010015261(A) 申请公布日期 2001.02.26
申请号 KR20000039249 申请日期 2000.07.10
申请人 TAIYO YUDEN CO LTD 发明人 OSHIMA GOSUKE
分类号 H01L23/16;H01L21/56;H01L21/68;H01L23/31;H01L23/552;H01L25/16;H05K1/02;H05K3/00;H05K3/28;H05K3/40;H05K9/00 主分类号 H01L23/16
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