| 摘要 |
PURPOSE: A mixed fused technology is provided to combine a laser actuation fuse with an electric starting fuse in order to increase total yield of product. CONSTITUTION: A plurality of different types of fuses(510), each serving a specified purpose, are arranged on a semiconductor integrated circuit wafer, such that a type of fuse can be actuated without missing the function of different types of fuses. A first type of fuse, e.g. a laser actuation fuse, is principally used for repairing a wafer level defect and a second type of fuse, e.g. an electric starting fuse, is used for repairing a defect found after an IC chip is mounted on a module and a stress is applied to the module during burn-in test. The module level defect is a unit cell trouble corrected normally by an electrically programmed fuse, in order to actuate a module level redundancy arrangement. |
