| 摘要 |
PROBLEM TO BE SOLVED: To prevent a plug loss of a tungsten plug without degrading a hole filling property, increasing plug resistance or causing trenching. SOLUTION: When a titanium film as an adhesive film for a tungsten plug is formed, an anisotropic sputtering method such as an ion metal plasma method or the like is employed and the film is made thick, 100 nm or greater. Consequently, when the adhesive film is removed, a tungsten film is projected. Thus, a plug loss of a tungsten plug can be prevented without degrading a hole filling property, increasing plug resistance or causing trenching. |
