| 摘要 |
PROBLEM TO BE SOLVED: To effectively clean without manual operation by coating the face of a metal mold which resin-seals a semiconductor element which a material containing the specified quantity of titanium oxide. SOLUTION: A plurality of cavities 2 where semiconductor elements which are resin-sealed are set are arranged on both sides of a runner 3 where resin flows when resin is filled. Resin is introduced to the cavities 2 from the runner 3 through a gate 4. The whole surfaces of the cavities 2, the runner 3 and the gate 4 are coated with a material 30 containing titanium oxide. It is desirable that the mixture of silicon oxide and titanium oxide, which is glassy containing silicon oxide, and a mix part material where the fine powders of the titanium oxide of 50 to 90 weight percent are dispersed is coated. Thus, the initial adhesion of resin is prevented, remaining resin is irradiated with ultraviolet rays and whole remaining resin can be removed.
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