| 摘要 |
PROBLEM TO BE SOLVED: To effectively use the image area of a solid-state image pickup ele ment from the use situation, to miniaturize a solid-state image pickup device imparted with high sensitivity. SOLUTION: In the device 16, an object image is made incident on an on-chip micro lens 29 through cover glass 2 and an air layer 33. A range outside the inner diameter 30a of a shielding mask 30 in an image which is made incident on the on-chip micro lens 29 is masked. A masked part on the inner side of the outer edge 28a of an image area 28 in a solid-state image pickup element chip 21 is effectively used as a space where adhesive 31 is applied. Since the space where adhesive 31 is applied is secured on the inner side of the outer edge 28a of the image 28, the solid-state image pickup device 16 can be miniaturized without increasing the peripheral area of the image area 28.
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