| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor device, using no interposers and pre vent fatigue breakdowns of I/O terminals under a temperature cycle environ ment, when a device is mounted on a mounting board. SOLUTION: This semiconductor device consists of a semiconductor element 10, having a plurality of electrodes 12 on the main surface, a film 20 bonded to the main surface of the semiconductor element 10 the film of has a plurality of thin wires 21 formed separately in a binder 22, and a plurality of I/O terminals 60 formed so as to be connected electrically with one end portions of the plurality of thin wires 21 exposed from a second surface of the film 20. Both end portions of the respective thin wires 21 are exposed from a first surface of the film 20 and the second surface facing the first surface. The other end portions of the thin wires 21 exposed from the first surface are connected electrically with the electrodes 12 of the semiconductor 10. |
