WIRING BOARD FOR HIGH FREQUENCY, AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To prevent generation of a resonance between a via hole conductor and a dielectric substrate end face at a connection part at connecting of a wiring board for a high frequency provided with a high frequency transmission line provided with a signal conductor line and a ground layer on a dielectric substrate with another high frequency circuit. SOLUTION: This wiring board is provided with the high frequency transmission line X, provided with the signal conductor line 2 formed on the surface of the dielectric substrate 1, whose terminating end part is extended to the vicinity of the end face (a) of the dielectric substrate 1 and the ground layer 3 formed inside the dielectric substrate 1 for transmitting high-frequency signals equal to or more than 30 GHz and a connection terminal part Y is formed at the terminating end part. A pair of ground conductors 4 for connection are formed on a substrate surface on both sides of the signal conductor line 2 at the connection terminal part Y and the ground conductors 4 for the connection are respectively connected to the ground layer 3 by the via hole conductor 5. Also, the distance of the via hole conductor 5 from the end face (a) of the dielectric substrate 1 is made equal to or more than 0.05 mm and equal to or less than 0.3-fold of the signal wavelength in the dielectric substrate 1 of the high frequency signals.