发明名称 VERFAHREN ZUM VERBINDEN EINES PORÖSEN MEDIUMS MIT EINEM SUBSTRAT
摘要 A method for bonding a porous medium (29) to the surface of a solid substrate (41) is disclosed. The method comprises positioning a dry porous medium (29) near a dry surface of a substrate (41) and impregnating the porous medium with a bonding composition by opening a valve (47) and allowing the bonding composition to pass through passageway (33) to groove (31). The impregnated porous medium (29) is maintained near the substrate surface (41) until the substrate surface is at least slightly dissolved in the bonding composition without dissolving the porous medium (29). At least a portion of the bonding composition is flushed through the impregnated porous medium (29) towards the substrate (41) and subsequently away from the surface of the substrate by opening of valve (44) at the adaptor (42) to a vacuum source (45). The bonding composition is then evaporated at a controlled rate from the substrate (41) and the porous medium (29). <IMAGE>
申请公布号 DE69425325(T2) 申请公布日期 2001.02.22
申请号 DE1994625325T 申请日期 1994.03.23
申请人 PALL CORP., EAST HILLS 发明人 PALL, BORIS;MUELLERS, T.
分类号 B01D63/00;B01D39/16;B01D63/08;B01D65/00;B01D69/10;B01D69/12;B01D71/12;B01D71/26;B01D71/32;B01D71/48;B01D71/56;B01D71/62;B29C65/48;B29L31/14;B32B3/30;B32B27/34;C08J5/12;C09J5/00;C09J5/02 主分类号 B01D63/00
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