Arrangement for treatment of substrates e.g. wafers during the finishing of electronic and microelectronic components comprises substrate support plates arranged over each other in a vacuum chamber

摘要

Arrangement for treatment substrates comprises two or more substrate support plates (1) arranged over each other in a vacuum chamber (2). Preferred Features: The substrate support plates are bombarded with electrical energy of a high frequency, or the substrates are treated by igniting a plasma.