发明名称 |
HERSTELLUNGSVERFAHREN EINER VORRICHTUNG ZUR ABFUHR VON WÄRME,DIE VON AUF EINER LEITERPLATTE ANGEORDNETEN SCHALTKREISEN ERZEUGT WIRD |
摘要 |
PCT No. PCT/FR97/01510 Sec. 371 Date Feb. 23, 1999 Sec. 102(e) Date Feb. 23, 1999 PCT Filed Aug. 21, 1997 PCT Pub. No. WO98/08363 PCT Pub. Date Feb. 26, 1998A method for manufacturing a device to dissipate the thermal energy produced by electronic components embedded in a printed circuit card, such method consisting in depositing on the card a first layer of a first thermally conductive and electrically insulating material to cover at least the connecting tabs for the electronic components to be cooled, and putting this first layer in contact with a metallic drain connected to a thermal mass to drain the calories towards the exterior of the card, wherein the method consisting is making the drain in the form of a flexible porous metallic structure, and in depositing on the drain a second layer of a second material that adheres to the first layer through the pores of the drain to hold the latter in place on the card. |
申请公布号 |
DE69703392(T2) |
申请公布日期 |
2001.02.22 |
申请号 |
DE1997603392T |
申请日期 |
1997.08.21 |
申请人 |
GIAT INDUSTRIES, VERSAILLES |
发明人 |
MOREAU, EMMANUEL;DESSAUX, CHRISTOPHE |
分类号 |
H05K3/28;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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