| 摘要 |
An integrated circuit die (1) carries conductive pads (2) and (3) thereon, the larger pads (2) being suitable for flip-chip assembly and the smaller pads (3) being suitable for wire bond assembly. The pitch between pads (2) is at least the minimum required for flip-chip assembly, whereas the pitch between each of pads (3) and the adjacent pad or pads is at least the minimum required for wire bond assembly. For wire bond assembly a passivation layer exposing all pads (2) and (3) is provided, whereas for flip-chip assembly a passivation layer 6 exposes only pads (2) so that conductive bumps (7) may be provided. The provision of pads (2) and (3) complying with the minimum spacing requirements for both flip-chip and wire bond assembly enables a "dual purpose" (e.g. one set of pads being for normal production and another set for testing purposes) die to be produced without any increase in die size. <IMAGE> |
