发明名称 ELECTROMAGNETIC SHIELD APPLICATION FLOORING METHOD
摘要 PROBLEM TO BE SOLVED: To apply an electromagnetic shield easily and at a low cost by applying a conductive application floor material on the upper face or the lower face of a floor concrete, and using the conductive application floor material on an electromagnetic shield material. SOLUTION: A conductive application floor material 2 is applied on the upper face of a floor concrete 1, and a floor finish material 4 is adhered to the upper face of the conductive application floor material 2 by an adhesive 3. The conductive application floor material 2 set at a cold temperature, is a conductive rubber composition capable of obtaining an arbitrary hardened substance, and contains a conductive rubber filler such as carbon powder, a carbon fiber and carbon black in the rubber composition. The volume inherent resistivity is preferably 100Ω.cm or less from the point of electromagnetic shield performance even in the conductive rubber composition. Adhesion between the materials considers recovering of the floor finish material 4, and the adhesion is selected in that the adhesion between the floor concrete 1 and the conductive application floor material 2 is stronger than the adhesion between the conductive application floor material 2 and the floor finish material 4.
申请公布号 JP2001049858(A) 申请公布日期 2001.02.20
申请号 JP19990221243 申请日期 1999.08.04
申请人 KANEGAFUCHI CHEM IND CO LTD;SHIMIZU CORP 发明人 HATANO TAKANORI;ANDO HIROSHI;MASAOKA YOSHITERU;KAWAKUBO FUMIO;KOKUBU MAKOTO;NUMATA SHIGEO;MORIHIRO ISAO;ONO TADASHI
分类号 B05D5/12;E04F15/12;H05K9/00;(IPC1-7):E04F15/12 主分类号 B05D5/12
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