| 摘要 |
A semiconductor integrated circuit device has a semiconductor chip having a plurality of input/output circuits and input/output pads connected individually thereto by metal conductors, and also has a frame on which the semiconductor chip is mounted. The pads of the semiconductor chip and a plurality of inner leads arranged on the frame are connected by wires that are wire-bonded thereto. The pads are arranged in two rows along each edge of the semiconductor chip. In the outer row, the pads are grouped into groups each consisting of pads arranged as close as possible to one another; spaces are secured between those groups and wires are arranged through those spaces. In the inner row, the pads are arranged in such positions where they can be connected to the wires arranged through the spaces secured between the groups of pads.
|
